http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11268440-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41N1-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-00 |
filingDate | 1998-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fcad43b05cc533a0a3e5a1848e8e754e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ded1f11ec9e626dd3bcb21fe8f964347 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_127860e7161b81ff30c6d15c669a0daa |
publicationDate | 1999-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-H11268440-A |
titleOfInvention | Masking material for solder printing |
abstract | (57) [Problem] To provide a solder printing masking material excellent in solder printability and suitable for a high-precision circuit board. SOLUTION: Particles having an average particle diameter of 2 μm or less are provided on both sides of an unoriented polyphenylene sulfide film layer (B layer) having an average particle diameter of 2 μm or less and 1.5% by weight or less. A laminated film in which another film having a softening point of 175 ° C. or more is laminated (layer A), and the crystallization temperature (Tcc) of layer B of the laminated film is 1 A masking material for solder printing, comprising a laminated film having a temperature in the range of 20 to 140C. |
priorityDate | 1998-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 28.