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filingDate 1998-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fcad43b05cc533a0a3e5a1848e8e754e
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publicationDate 1999-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H11268440-A
titleOfInvention Masking material for solder printing
abstract (57) [Problem] To provide a solder printing masking material excellent in solder printability and suitable for a high-precision circuit board. SOLUTION: Particles having an average particle diameter of 2 μm or less are provided on both sides of an unoriented polyphenylene sulfide film layer (B layer) having an average particle diameter of 2 μm or less and 1.5% by weight or less. A laminated film in which another film having a softening point of 175 ° C. or more is laminated (layer A), and the crystallization temperature (Tcc) of layer B of the laminated film is 1 A masking material for solder printing, comprising a laminated film having a temperature in the range of 20 to 140C.
priorityDate 1998-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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