http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11266067-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_696ca0ae93d5cf5a686273601361781f |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-382 |
| filingDate | 1998-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_22bccf4e7640f08285550ec8cbc42184 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6067b0bb69604ac7b27d222adb57edf1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ecd4611456f1baab9e1f971fe64f294a |
| publicationDate | 1999-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H11266067-A |
| titleOfInvention | Method of forming through hole for through hole |
| abstract | (57) [Problem] To accurately and directly form high-speed through holes for through holes in a copper-clad laminate using a carbon dioxide gas laser. A thermosetting resin copper-clad laminate having at least two or more copper layers using one energy selected from 20 to 60 mJ / pulse sufficient to remove copper foil with a carbon dioxide gas laser. One or two or more components of metal compound powder and carbon powder having a melting point of 900 ° C or more and an atomic bond energy of 300 kJ / mol or more An organic paint or sheet containing 97 vol% is placed and a carbon dioxide laser is directly irradiated to form through holes for through holes, and then both surfaces of the metal foil are flattened at a speed of 0.02 to 1.0 μm / sec. 1/3 to 1/2 of the original metal foil The thickness of the hole is removed by etching, and at the same time, the burr of the hole is also removed by etching to form a through-hole through hole. [Effects] There is no difference in the positions of the holes on the front and back sides, and a through-hole having excellent through-hole reliability can be formed at a high speed and is suitable for forming a high-density circuit. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109640518-A |
| priorityDate | 1998-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 76.