| abstract |
(57) Abstract: The present invention provides a gold alloy thin wire for a semiconductor element suitable for high-density mounting, which can cope with narrow pitch and long span by reducing wire deformation during resin sealing. The purpose is to: SOLUTION: (1) 0.015 to 1.0% by weight of Cu And Ca in the range of 0.0002 to 0.1. A gold alloy thin wire for a semiconductor element, which is contained in the range of 02% by weight, with the balance being gold and its unavoidable impurities. (2) The metal for a semiconductor element, wherein the component (1) further contains one or more of Pt, Pd, and In in a total amount of 0.01 to 3.0% by weight. Alloy fine wire. (3) In addition to the components (1) or (2), Y and L a, one or two or more of Ce in total of 0.0003 to A gold alloy thin wire for a semiconductor element, which is contained in a range of 0.03% by weight. |