| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_962adbf7d50e742218f3d536a63df612 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| filingDate |
1997-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2c677f51ac2a6677cdf80946b3241fba
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_35901b309140097fa1223cb5bc493d08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5554b3304177e67166ffaa8813144a3d |
| publicationDate |
1999-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H1126406-A |
| titleOfInvention |
Wafer grinding method |
| abstract |
(57) [Problem] To provide a wafer grinding method capable of manufacturing an extremely thin IC chip with high yield. SOLUTION: The wafer grinding method according to the present invention is characterized in that an energy ray-curable pressure-sensitive adhesive sheet is attached to a wafer surface on which a circuit is formed, and the pressure-sensitive adhesive layer is cured by irradiating an energy ray, and then the pressure-sensitive adhesive sheet is cured. Is characterized in that the back surface of the wafer is ground in a state in which is adhered to the front surface of the wafer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007148506-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016129577-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005051229-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011029450-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2006060983-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2006060983-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001284303-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008098669-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4578165-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000340636-A |
| priorityDate |
1997-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |