| abstract |
PROBLEM TO BE SOLVED: To provide a cured product having excellent fluidity, storage stability, curability, excellent adhesiveness, a small amount of package warpage, a small wire flow rate, and excellent workability and reliability. An epoxy resin composition is obtained. SOLUTION: A polyfunctional epoxy resin of the formula (1), a polyfunctional phenol resin curing agent of the formula (2), an organic phosphorus-based curing accelerator, an aminosilane coupling agent, and an inorganic filler are essential. An epoxy resin composition for semiconductor encapsulation as a component. Embedded image (R 1 and R 2 are H, —CH 3 or —C (CH 3 ) 3 , R 3 is H, —CH 3 or —C 2 H 5 , and k is an integer of 1 to 5.) ] (R 1 to R 3 are as described above, and n is an integer of 1 to 5.) |