| abstract |
(57) [Summary] [PROBLEMS] Not only high heat resistance, low moisture absorption, low dielectric constant, but also effective as an insulating material for electric and electronic parts, Provided is a photosensitive resin composition capable of forming a fine pattern and miniaturizing an electric / electronic component. In a photosensitive resin composition which is insolubilized by activating light, a cured product obtained by irradiating the resin composition with light has a relative dielectric constant of 2.5 to 3.8 and a saturated moisture absorption of 0.3 to 3.8. 1.5%, A photosensitive resin composition having a thermal decomposition onset temperature of 400 ° C. or higher. |