Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J179-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-05 |
filingDate |
1998-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_119212de445f2726a4f0a62bf76a127d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_25602ddb5505903ea004b498f7c51d71 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b957f074d56e5f1bfb1bdbb58575ef42 |
publicationDate |
1999-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-H11238954-A |
titleOfInvention |
Low thermal expansion circuit board and multilayer wiring circuit board |
abstract |
(57) Abstract: Provided is a low thermal expansion circuit board on which a semiconductor element can be mounted with high reliability and ease. A low-thermal-expansion circuit board (1) in which wiring conductors (4) are provided on both surfaces of an insulating layer (3) on which a Ni-Fe-based alloy foil (2) or a titanium foil is disposed as a core material. Then, an adhesive resin layer 5 is provided on the semiconductor element mounting surface of the low thermal expansion circuit board 1. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9099315-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007180083-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007180357-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8997340-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009246333-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10225920-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/AT-515069-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009246120-A |
priorityDate |
1997-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |