http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11238747-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
filingDate 1998-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1d95307b9173dcb059d1f78d207e45fd
publicationDate 1999-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H11238747-A
titleOfInvention Mold resin etching method and etching apparatus
abstract (57) [Problem] To provide a mold resin which can be efficiently and efficiently controlled and economically etched regardless of the glass transition temperature Tg of the mold resin. An etching method and an apparatus for etching a mold resin are provided. SOLUTION: A mold resin for etching a mold resin 8 of a completed chip 21 using a chemical solution 5 for decomposing a resin component of a mold resin 8 and a laser beam 4 having a function of increasing the temperature of the chemical solution 5. Etching method and apparatus.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1276142-A3
priorityDate 1998-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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