http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11220254-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
filingDate 1998-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d6784989d778997396f36571ea3aea54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_56273294d768a6eb535c01b3fbad53aa
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publicationDate 1999-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H11220254-A
titleOfInvention Wiring board and manufacturing method thereof
abstract (57) [Abstract] [Problem] By chemical interaction without roughening a resin substrate, Provided is a wiring board capable of increasing the adhesion between a resin substrate and a metal to be deposited and providing fine wiring on the resin substrate, and a method for manufacturing the same. A wiring board is formed of a resin substrate, a metal film deposited on the resin substrate, and an amide formed on the surface of the contact interface between the metal film and the resin substrate on the resin substrate side. The metal film 1 comprising a layer 12 containing a group and a metal oxide film 13 formed on the surface of the contact interface on the metal film 14 side. A wiring having 4 as a conductor is provided on the resin substrate 11. As described above, since the amide group-containing layer 12 and the metal oxide film 13 are in contact with each other and have a chemical interaction, a wiring board having excellent adhesion can be obtained, and the wiring board and a method of manufacturing the wiring board can be obtained. Can be provided.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006324475-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002064277-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7022412-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012194014-A
priorityDate 1998-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 41.