http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11220067-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_696ca0ae93d5cf5a686273601361781f |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 1998-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6067b0bb69604ac7b27d222adb57edf1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_22bccf4e7640f08285550ec8cbc42184 |
| publicationDate | 1999-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H11220067-A |
| titleOfInvention | Semiconductor plastic package |
| abstract | (57) [Problem] To provide a double-sided metal foil-clad laminate of a semiconductor plastic package excellent in heat dissipation and heat resistance after moisture absorption. SOLUTION: This is a semiconductor plastic package of a ball grid array using a metal-core printed wiring board, wherein the front and back circuits and through holes are insulated from the metal plate with a thermosetting resin, and the conductor on the surface on which the semiconductor chip is mounted and the opposite. A semiconductor with a solder ball pad on the surface connected by a metal plate and metal plating with a plurality of blind via holes, and a semiconductor chip bonded to the conductor in the blind hole part is connected by wire bonding, and the semiconductor chip part is sealed with resin. Plastic package. [Effect] A double-sided metal foil-clad laminate for a semiconductor plastic package having a novel structure that is excellent in heat dissipation and heat resistance after moisture absorption, and suitable for mass production was obtained. |
| priorityDate | 1998-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 62.