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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C28-00
filingDate 1998-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_51473951a590ac67cf02b09989ce1175
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publicationDate 1999-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H11217674-A
titleOfInvention Plated non-conductive product and plating method thereof
abstract (57) [Problem] To provide a method for forming a plating layer which adheres very firmly to the surface of a nonconductor product. SOLUTION: After forming a coating on a required portion of a nonconductive product surface by using a conductive paint having a solid component having the following composition: (A) a resin vehicle of 20 to 80% by weight; and (B) a conductive whisker of 80 to 20% by weight. A method of plating non-conductive products, characterized by applying electroless plating on the surface of the coating, or a method of forming microvoids on the surface of the coating to improve the adhesion of the plating layer when forming the coating .
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112746298-A
priorityDate 1997-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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