http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11217674-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0fe5a65c921aba493f931175179ccbf5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ec2fc9e6fe584d518acbecfbc41a2f02 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C28-00 |
filingDate | 1998-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_51473951a590ac67cf02b09989ce1175 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2392790319c02b24806e70b53d76e7a6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d1d0aeb7d7415e12e17ebfd7e5628b93 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4b0a335f83e9d89f62d9bd120d4c41c6 |
publicationDate | 1999-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-H11217674-A |
titleOfInvention | Plated non-conductive product and plating method thereof |
abstract | (57) [Problem] To provide a method for forming a plating layer which adheres very firmly to the surface of a nonconductor product. SOLUTION: After forming a coating on a required portion of a nonconductive product surface by using a conductive paint having a solid component having the following composition: (A) a resin vehicle of 20 to 80% by weight; and (B) a conductive whisker of 80 to 20% by weight. A method of plating non-conductive products, characterized by applying electroless plating on the surface of the coating, or a method of forming microvoids on the surface of the coating to improve the adhesion of the plating layer when forming the coating . |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112746298-A |
priorityDate | 1997-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 29.