| abstract |
(57) [Problem] To provide an epoxy resin molding material for electronic parts encapsulation which can achieve flame retardancy with non-halogen and non-antimony, and is excellent in curability and cured product characteristics. (A) an epoxy resin, (B) a curing agent, (C) magnesium hydroxide, (D) a nitrogen-containing compound, (E) An inorganic filler is an essential component, and a nitrogen-containing compound of (D) is an epoxy resin of (A) and / or (B) An epoxy resin molding material for electronic component encapsulation, having a functional group capable of reacting with a component curing agent. |