| abstract |
(57) [Problem] To provide a wire saw capable of performing slicing processing of a silicon wafer and a method of using the same. SOLUTION: On the outer peripheral surface of a core wire 1 composed of carbon fibers or a fiber filament mainly composed of carbon fibers, the resin wire has a particle diameter of 2/3 or more of the thickness of the resin bond layer and 1/2 or less of the fiber filament. After applying a resin solution mixed with the abrasive grains 3 and the filler 4 having a particle diameter of less than 2/3 of the resin bond layer thickness, the resin solution is heated and raised by the resin bond 5 on the outer periphery of the core wire, A fixed wire saw. At the time of use, electricity is supplied to the core wire 1 of the wire saw to measure the electric resistance. |