http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11214608-A

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filingDate 1998-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1d9f46c56b20180b0660f7aa4666061e
publicationDate 1999-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H11214608-A
titleOfInvention Package for storing semiconductor elements
abstract (57) Abstract: A semiconductor element storage package having a connecting member for connecting an external lead terminal and a connecting member for connecting the connecting member has a crack in the connecting member near a joint between the connecting member and the connecting member. There is a drawback that tends to occur. SOLUTION: A rectangular insulating container 4 accommodating a semiconductor element 3, a plurality of external lead terminals 7 protruding from a side of the insulating container 4, and an electric insulating material connecting the external lead terminals 7 for each side. A semiconductor device housing package comprising a band-shaped connecting member 8 and a band-shaped connecting member 9 for connecting an end of an adjacent connecting member 8, wherein at least one connecting member 9 is provided on each of both sides. Is formed. Since the notch 10 absorbs thermal stress when the external lead terminal 7 and the joint fitting 9 are joined to the connecting member 8, cracks are less likely to occur in the connecting member 8.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011249575-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012089897-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7541670-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107527892-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010010336-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015225949-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010177409-A
priorityDate 1998-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 28.