http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11214598-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ee3df51ddf361aba94390400af67bfe0
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L35-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-38
filingDate 1998-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0327de8377d448f9a80b2e9b9a9626c6
publicationDate 1999-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H11214598-A
titleOfInvention Cooling method for large-scale integrated circuit (LSI) chips
abstract (57) [Abstract] The present invention aims to improve cooling efficiency by directly providing a Peltier element on an LSI chip. [Configuration] In an LSI chip 4, a Peltier element (P (P type) 7, metal 1, Peltier element (N type) 2 This is a method of directly cooling the SI chip 4.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107851705-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008526035-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20030026835-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007507909-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8686277-B2
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107851705-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8803275-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-101930954-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015076607-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2008123083-A1
priorityDate 1998-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 29.