| abstract |
PROBLEM TO BE SOLVED: To provide an epoxy resin molding material for electronic component sealing having excellent storage stability and high adhesiveness, and to provide an electronic component device excellent in moisture resistance. SOLUTION: Cresol novolak type epoxy resin, Brominated bisphenol A type epoxy resin, phenol novolak resin, carnauba wax, antimony trioxide, Carbon black, γ-glycidoxypropyltrimethoxysilane, fused silica, and the following curing accelerator-1 Epoxy resin molding material for electronic parts encapsulation. Embedded image |