http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H1121426-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 |
| filingDate | 1997-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a39ef7424ff721b11dda09a52a5f8a1b |
| publicationDate | 1999-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H1121426-A |
| titleOfInvention | Epoxy resin composition for semiconductor encapsulation |
| abstract | [PROBLEMS] To provide an epoxy resin composition for semiconductor encapsulation having excellent storage stability at normal temperature, moldability, and resistance to soldering stress. SOLUTION: A crystalline epoxy compound having a melting point of 50 to 150 ° C., a resin curing agent containing 30 to 100% by weight of a dihydroxybenzene / alkylbenzene / aldehyde resin curing agent in all resin curing agents, and a curing represented by the general formula (5) Accelerator, and an inorganic filler as an essential component, the equivalent ratio of the epoxy group of the crystalline epoxy compound to the phenolic hydroxyl group of the resin curing agent is 0.5 to 2, and the curing accelerator is a crystalline epoxy compound and 0.4 to 20 parts by weight per 100 parts by weight of the total amount of the resin curing agent, and the content of the inorganic filler is 200 to 2400 parts by weight per 100 parts by weight of the total amount of the crystalline epoxy compound and the resin curing agent. An epoxy resin composition for semiconductor encapsulation characterized by the following. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000281875-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001261779-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110461938-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8642714-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020045423-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001233933-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009171061-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4622024-B2 |
| priorityDate | 1997-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 234.