| abstract |
(57) Abstract: A photocurable resin which has a remarkably improved photocurability, can be cured with a small amount of UV exposure, has excellent performance, and can be developed with a dilute alkali. Provided is a solder photoresist ink composition containing a resin. The epoxy resin is obtained by reacting 0.5 to 50 mol% of a monocarboxylic acid having two or more acryloyl groups in one molecule with 50 to 99.5 mol% of acrylic acid or methacrylic acid. The compound, a photocurable resin having a radically polymerizable unsaturated acyl group and a carboxyl group obtained by further reacting a dibasic acid anhydride, A solder photoresist ink composition comprising a photopolymerization initiator, a diluent, and a thermosetting resin mixed with the photocurable resin. |