http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11211754-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6572309f22e2ad56c1390a78ac237bed
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B37-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R33-76
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-073
filingDate 1998-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b6065df014723504dd955f2dd25e91a1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8dfc2090b05abdcbeea76f23f391bcb4
publicationDate 1999-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H11211754-A
titleOfInvention Electrical connector and method of manufacturing the same
abstract (57) [Abstract] (with correction) [PROBLEMS] To provide an electrical connector which suppresses variation in connection resistance of each terminal and can be used for a multi-pin BGA or the like, and a method of manufacturing the same. The composite layer includes a silicone rubber layer, a plurality of terminal members provided on a back surface of the silicone rubber layer via a first polyimide resin layer, and a second polyimide layer provided on a surface of the silicone rubber layer. The resin layer 4 is laminated. Further, each wire 10 is longer than the composite layer, and both end portions thereof are straight portions, and the remaining portion is bent in a direction intersecting with the thickness direction of the composite layer to form a surplus bending portion 11, and one end portion of each wire 10 is a The terminal member 7 is held by one polyimide resin layer 2 and To form a large terminal portion. In addition, each wire 1 The other end of the ball contact portion 15 is held on the second polyimide resin layer 4 as a ball contact portion 15, and at least a part of each ball contact portion 15 is exposed from the second polyimide resin layer 4, and the exposed surface has a hard surface. Gold plating 16 is applied.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001249145-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012220451-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002075569-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014112072-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100765977-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010054463-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002107416-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101344802-B1
priorityDate 1998-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23985

Total number of triples: 28.