| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0326 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24 |
| filingDate |
1998-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8fc70bfb160587a111643aa05749cde4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_db8c3b14f2a530f7b3d7075aad27e308
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e1654ce92148b37e645be68e58c91d41
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9b408a4fe242c580a6f0b6aad937fd31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b63c6f31f9d9f92b277d51e6aadcee6d |
| publicationDate |
1999-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H11209582-A |
| titleOfInvention |
Epoxy resin composition for laminate, prepreg and laminate using the same |
| abstract |
(57) [Summary] [Problems] To quickly cure during heat molding to give a high-quality molded product, and has good moldability, and can be stably stored for a long time at around normal temperature. Provided are an epoxy resin composition for a laminate, and a prepreg and a laminate using the same. SOLUTION: An epoxy resin (A), a polyamine (B), and an organic phosphorane (C) having a curing promoting effect and represented by the general formula [1] are uniformly dissolved in an organic solvent. Embedded image |
| priorityDate |
1998-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |