http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11199650-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 1998-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d296cef402099b61ca6e9876c10beb8b |
| publicationDate | 1999-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H11199650-A |
| titleOfInvention | Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| abstract | PROBLEM TO BE SOLVED: To provide a cured product having better fluidity and excellent moldability as compared with a case where a conventional biphenyl type epoxy resin is used, and to provide a semiconductor device with high reliability. An epoxy resin composition for semiconductor encapsulation capable of manufacturing a semiconductor device having excellent properties. SOLUTION: In an epoxy resin composition containing an epoxy resin, a phenolic curing agent and an inorganic filler, the epoxy resin is represented by the following general formula (1): A biphenyl type epoxy resin having a total volatile component content of 2% by weight or less and / or a dimer thereof is blended. Embedded image (Where R is a hydrogen atom or a monovalent organic group having 1 to 5 carbon atoms, G is a glycidyl group, and n is an integer of 0 to 4). |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100561569-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100561575-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007039551-A |
| priorityDate | 1998-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 35.