http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11181379-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J109-02
filingDate 1997-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5d6683c396ee3175b7364cd4a3f709a8
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publicationDate 1999-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H11181379-A
titleOfInvention Manufacturing method of adhesive for electroless plating
abstract PROBLEM TO BE SOLVED: To provide a method for uniformly dispersing crosslinked acrylonitrile-butadiene rubber particles having a primary average particle diameter of about 0.01 to 0.1 μm in a primary particle diameter state without swelling and dissolving. . SOLUTION: In a method for producing an adhesive which essentially contains crosslinked acrylonitrile butadiene rubber particles and a surface tension reducing agent as an adhesive composition, an electroless method in which the crosslinked acrylonitrile butadiene rubber particles and a surface tension reducing agent are first mixed. Manufacturing method of plating adhesive. It is preferable to use a copolymer resin of ethyl acrylate and ethyl hexyl acrylate or at least one of dimethyl silicone, methyl phenyl silicone and methyl hydrogen silicone as a surface tension reducing agent.
priorityDate 1997-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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