| abstract |
(57) Abstract: A wiring board that can be fired at 800 to 1000 ° C., has a low dielectric constant, a low dielectric loss, and a high coefficient of thermal expansion in a high frequency range, and can be mounted on a printed board with high reliability. And provide its mounting structure. A wiring board having an insulating substrate, a wiring layer, and a connection terminal is mounted on an external electric circuit board having a wiring conductor on a surface of an insulating substrate containing an organic resin. When the connection terminal 8 is soldered and mounted on the wiring conductor 10, the insulating substrate 1 of the wiring board A is made of Si, Al, Zn, It contains Mg and Zr, and contains at least one or more elements selected from Ca, Sr and Ba as constituent elements, and forms a SiO 2 crystal phase (Si) such as quartz and a spinel type crystal phase (SP) such as garnite. Mainly monoclinic and / or Alternatively, it is composed of a composite oxide sintered body containing a ZrO 2 crystal phase such as tetragonal and having a thermal expansion coefficient from room temperature to 400 ° C. of 7 ppm / ° C. or more. |