http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11171673-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C04B35-571
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C04B41-88
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22F1-04
filingDate 1997-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e2a1b55f7f40e6ab025465e26a01cf2b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e53e88c423dc3654a2a24e9360c90585
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b177494013bf411d28dfb142597688f7
publicationDate 1999-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H11171673-A
titleOfInvention Composite, heat sink using the same, and methods of manufacturing the same
abstract (57) Abstract: Provided is an aluminum-silicon carbide composite having a high thermal conductivity and a low coefficient of thermal expansion, which is suitable as a heat sink for a ceramic circuit board. A silicon carbide porous body having a honeycomb structure is impregnated with a metal containing aluminum as a main component. The silicon carbide body has a honeycomb structure in which voids (cells) are filled with a highly thermally conductive substance. A composite obtained by impregnating a porous body with a metal containing aluminum as a main component. It has a characteristic that the coefficient of thermal expansion at 8 ° C. is 8 × 10 −6 / K or less and the thermal conductivity at 25 ° C. is 170 W / (m · K) or more.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004142978-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102720569-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2505571-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2012132837-A1
priorityDate 1997-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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