abstract |
[PROBLEMS] To provide an epoxy resin composition for semiconductor encapsulation excellent in moldability, reliability, and low warpage when a BGA package is encapsulated, and a semiconductor device using the same. A semiconductor element is encapsulated with an epoxy resin composition containing, as essential components, a biphenyl type epoxy resin, a phenol resin curing agent having a naphthalene structure, triphenylphosphine and a benzoquinone adduct accelerator. |