| abstract |
PROBLEM TO BE SOLVED: To provide a high-quality molded product by being quickly cured at the time of heat molding and to have good moldability, and to be able to be stably stored at about room temperature for a long period of time. Provided are an epoxy resin composition for a board, and a prepreg and a laminate using the same. SOLUTION: The epoxy resin (A), an epoxy resin curing agent (B) which is one selected from polyamine, polyphenol or acid anhydride, and represented by the general formula [1] having a curing accelerating effect. Quaternary phosphonium compound (C) Is uniformly dissolved in the organic solvent. Embedded image |