http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11150349-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4a8faea375370b67c9d71e67db32bcd |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-16 |
| filingDate | 1997-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3b1534d047f01c806789ec45ca3f4c89 |
| publicationDate | 1999-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H11150349-A |
| titleOfInvention | Circuit board with capacitive element |
| abstract | [PROBLEMS] To reliably connect a capacitance element having a predetermined capacitance value between thin film circuit wirings provided on an insulating substrate. A thin film capacitor having a lower electrode layer and an upper electrode layer disposed on both upper and lower surfaces of a dielectric layer is disposed on an insulating substrate having a plurality of thin film circuit wirings. A capacitive element formed by placing the lower electrode layer 4 of the capacitive element 3 on the thin film circuit wiring layer 2a and connecting the same, and electrically connecting the upper electrode layer 6 to another thin film circuit wiring 2b via the bonding wire 7. The upper electrode layer 6 of the thin-film capacitive element 3 is made of a metal having a proof stress of 0.08 GPa or less and has a thickness of 5 to 20 μm. |
| priorityDate | 1997-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 20.