| abstract |
[PROBLEMS] To provide an epoxy resin composition excellent in low water absorption and high adhesion, and a resin-sealed semiconductor device excellent in package crack resistance. SOLUTION: 4,4'-bis (2,3-epoxypropoxy) -3, 50% to 70% by weight of 3 ', 5,5'-tetramethylstilbene and 4, 4'-bis (2,3-epoxypropoxy) -5-t-butyl-2,3 ', 5' A mixture of 30 to 50% by weight of trimethylstilbene, a phenol resin having a hydroxyl equivalent of 120 to 230, an epoxy resin composition containing a curing accelerator and an inorganic filler as essential components, and encapsulating a semiconductor element with the epoxy resin composition Semiconductor device. |