http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11145347-A

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filingDate 1997-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8c76ba9a985ab850fc1755584847a503
publicationDate 1999-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H11145347-A
titleOfInvention Resin-sealed electronic components
abstract (57) [Summary] [PROBLEMS] To improve the heat radiation of a resin-sealed electronic component to which an external heat radiator is attached. A resin-sealed electronic component (1) according to the present invention is provided. In 1), a metal layer (17) is fixed to a second main surface (16b) perpendicular to the first main surface (16a) of the resin sealing body (16) from which the external leads (13) are led out. And adhesive (1 The heat radiator (20) is bonded to the metal layer (17) via 9). An external heat radiator (2) is attached to the second main surface (16b) of the resin sealing body (16) via the metal layer (17) and the adhesive (19). Since 0) is fixed, good heat dissipation is obtained.
priorityDate 1997-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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