| abstract |
(57) Abstract: A thermoplastic resin having a molecular weight of 400 to 150. 0 thermosetting resin and, if necessary, a filler, are mixed in an organic solvent to form a layer of the mixed solution on a substrate, 250 ° C by heating and drying to remove the substrate 1mm adhesive film when heated for 2 minutes An adhesive film of 100 μg or less per 3 is obtained. A polyimide resin is preferable as the thermoplastic resin, and an epoxy resin is preferable as the thermosetting resin. The adhesive film of the present invention withstands heat treatment for soldering at the time of mounting and generates a small amount of outgas (fume), so that it does not contaminate the semiconductor element or the heating device. |