| abstract |
(57) [Summary] The present invention relates to a method for recycling a photoresist solution. In a conventional method of applying a photoresist on a support, for example, by spin coating, Most of the resist is shaken off from the wafer by rotation. According to the present invention, the excess photoresist solution obtained from the coating process is collected and its solids content is adjusted to be suitable for use as a coating composition. Thereafter, particles and contaminants are removed from the solution. The photoresist is then reused to be applied on a support. |