http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11130942-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3f548ca15b9b5748f1afd80e3d1636ec |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-37 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 1997-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5e794de57e59344c32f380602e757732 |
| publicationDate | 1999-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H11130942-A |
| titleOfInvention | Sealing resin composition and semiconductor sealing device |
| abstract | PROBLEM TO BE SOLVED: To improve the adhesion between a pre-plating frame such as Pd / Pd-Au and a resin composition, to improve the reflow resistance of a semiconductor encapsulation device, and to provide moisture resistance after reflow. Provided is a semiconductor encapsulation device that prevents deterioration and has high reliability. An epoxy resin, (B) a novolak-type phenol resin, (C) 2-benzothiazolyl disulfide, and (D) an inorganic filler are essential components. A) a resin composition for encapsulation comprising 0.001 to 0.1% by weight of 2-benzothiazolyl disulfide and 25 to 95% by weight of the inorganic filler of (D). Pd encapsulated by the composition It is a semiconductor sealing device using a pre-plating frame such as Pd-Au or Pd-Au. |
| priorityDate | 1997-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 25.