http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11130941-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3f548ca15b9b5748f1afd80e3d1636ec |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24 |
| filingDate | 1997-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2f77a7614eaf55a4ec347da93580686e |
| publicationDate | 1999-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H11130941-A |
| titleOfInvention | Epoxy resin composition and semiconductor encapsulation device |
| abstract | (57) [Summary] [Problem] Especially excellent in moisture resistance, reflow resistance, and moldability after surface mounting by IR reflow, no peeling between semiconductor chip or lead frame and generation of internal resin cracks, long-term reliability Provided are an epoxy resin composition and a semiconductor encapsulation device that can guarantee the property. (A) An epoxy resin represented by the following formula: (B) a phenolic resin represented by the following formula: (C) An epoxy resin composition comprising an inorganic filler as an essential component and the inorganic filler of (C) in a proportion of 25 to 95% by weight based on the whole resin composition. This is a semiconductor sealing device in which a semiconductor chip is sealed with a cured product of a resin composition. |
| priorityDate | 1997-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 36.