http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11130837-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate | 1997-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b2734ad61dedaae0120a04c766000f23 |
| publicationDate | 1999-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H11130837-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor encapsulation which is excellent in moldability, low warpage and solder crack resistance, and is particularly suitable for a BGA package. SOLUTION: A mixture of a stilbene type epoxy resin represented by the general formula (1) and a stilbene type epoxy resin represented by the general formula (2) has a melting point of 50 to 150 ° C., and is represented by the general formula (3). An epoxy resin composition comprising, as essential components, a phenol resin, a curing accelerator, and an inorganic filler. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001089636-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4617532-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4617531-B2 |
| priorityDate | 1997-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 65.