http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11126973-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2221286a875503da57e4f2a46621c4ef |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40 |
| filingDate | 1997-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ec4867d42000b3671679d5e5192266f1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_88a60a38b6259b3df359f123c7f9e1c1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ea7097815ff0c32d79749f1adf6f68d1 |
| publicationDate | 1999-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H11126973-A |
| titleOfInvention | Method for manufacturing multilayer wiring board |
| abstract | PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer wiring board which solves the problem that conventionally requires a very large number of steps and increases the material cost, and has high reliability and excellent workability. To provide. SOLUTION: (1) a step of forming a conductor circuit on a substrate, (2) a step of forming a columnar conductor on a conductor of the substrate using a conductive polymer thick film paste, and (3) a columnar conductor. Manufacturing a multilayer wiring board comprising: a step of covering the periphery of the substrate with an insulating layer; (4) a step of exposing the head of the columnar conductor buried by the insulating layer by laser irradiation; and (5) a step of forming a conductor on the surface. Method. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8110118-B2 |
| priorityDate | 1997-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 33.