| abstract |
A technique for removably mounting a semiconductor die and a package on a circuit board is provided. A resilient contact structure extends from an upper surface of the support substrate, and a solder ball (or other suitable) contact structure is disposed on the lower surface of the support substrate. An interconnect element (110) is disposed on top of the support substrate, used as a resilient contact structure. A selected one of the resilient contact structures on the top of the support substrate is connected via the support substrate to a corresponding one of the contact structures on the lower surface of the support substrate. . |