http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11118866-A

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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-00
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filingDate 1997-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_01ac7e29615fa522c2122c55c6b20705
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_09ff741f6cdedc01dafd2ba07ec68c01
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publicationDate 1999-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H11118866-A
titleOfInvention Tape carrier package semiconductor device, disconnection test method thereof, and liquid crystal panel display device using the same
abstract (57) Abstract: A practical disconnection test method for a flex TCP semiconductor device is provided. SOLUTION: A slit 3 is provided in a polyimide substrate 2, A copper wiring pattern 4 is formed so as to cross over the slit 3 and the copper wiring pattern 4 near the slit 3 is covered with a solder resist 6 to produce a TEG 1. TE G1... Using the ACF13 for the liquid crystal panel 11 and the PWB After mounting on the substrate 12, the TEGs 1... Are curved so that the liquid crystal panel 11 and the PWB substrate 12 face each other, and several samples for a disconnection test are produced. Next, these disconnection test samples were put in a temperature cycle bath, and 85 ° C and -30 ° C. Is repeated for 30 minutes. Then, the number of cycles at which the copper wiring patterns 4... Of the disconnection test sample start to be disconnected is counted. This shows that the TEG1 having a structure that does not disconnect within 200 cycles is suitable for an actual TCP semiconductor device.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8808837-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006073966-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008233358-A
priorityDate 1997-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 30.