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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-786
filingDate 1997-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_21747acfb77b0d181ab4dff0d66658d4
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publicationDate 1999-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H11112001-A
titleOfInvention Semiconductor device and manufacturing method thereof
abstract (57) [Problem] To provide a semiconductor device with high productivity and high reliability and reproducibility by a simple manufacturing process. In a structure of a bottom-gate type semiconductor device formed of a semiconductor layer having a crystal structure, a source / drain region is formed of a first conductive layer (n + layer) and a second conductive layer having a higher resistance than the first conductive layer (n + layer). It has a layered structure including a layer (n − layer) and an intrinsic or substantially intrinsic semiconductor layer (i-layer). At this time, the n − layer functions as an LDD region, and the i layer functions as an offset region in the thickness direction.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8872750-B2
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012164989-A
priorityDate 1997-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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