http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11103175-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L21-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-3415 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-3437 |
| filingDate | 1998-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0587152f0e98544b9e8f618bfa7743c8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e7f25ae21d3282ee91ab3893ffa14ee7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6bb5c69a470e738869e8a5fe440642c0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_df7e2e46dcc2656f905e8eef7a463be5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f451511b12b30df228a7eb54ff6a95cb |
| publicationDate | 1999-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H11103175-A |
| titleOfInvention | Method for producing multilayer wiring board using resin composition curable by heat or light |
| abstract | PROBLEM TO BE SOLVED: To provide a multi-layer using a resin composition having excellent heat resistance to simultaneously impart photo-curing and thermo-curing properties utilizing the high heat resistance of a bismaleimide compound to an insulating layer of a multilayer wiring board. Provided is a method for manufacturing a wiring board. SOLUTION: An insulating layer is formed on a circuit surface of an insulating substrate on which a first circuit is formed, a via hole for connecting to the first circuit is formed in the insulating layer, and copper is plated on the insulating layer surface by copper plating. In the second method for producing a wiring board in which a circuit is formed and a via hole is connected between layers to form a multilayer structure, the insulating layer may contain (A) a bismaleimide compound in an amount of 5 to 90% by weight; (C) A specific acridine compound 0.1 as a thermosetting accelerator or a photoinitiator, based on 10 to 95% by weight of the other resin component and 100 parts by weight in total of (A) and (B). A method for producing a multilayer wiring board using a resin composition curable by heat or light containing up to 30 parts by weight. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011116988-A |
| priorityDate | 1997-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 79.