| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_dca153f19868f747eeea612b047a9e7c |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-382
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate |
1998-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_423023b96dfb1a1f5af26c352ce6978c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8f0b5a04b08630d89b24ca9ac91dcd60 |
| publicationDate |
1999-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H11103149-A |
| titleOfInvention |
Via hole forming method and laser processing apparatus |
| abstract |
(57) [Problem] To provide a via hole forming method that does not require a complicated post-processing step such as a wet post-processing. A method of forming a via hole reaching a metal film in a polymer layer on a metal film, the method comprising: a first step of forming a via hole in the polymer layer using a laser beam; and a dry process. A second step of removing processing residue from the via hole. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002113587-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-101905382-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003511240-A |
| priorityDate |
1995-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |