http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11102995-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4a8faea375370b67c9d71e67db32bcd |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 1997-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4ccb393a036671ca29a3f0f0244fb2dd |
| publicationDate | 1999-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H11102995-A |
| titleOfInvention | Manufacturing method of wiring board |
| abstract | (57) [Problem] To increase the strength of adhesion to an insulating substrate by increasing the epoxy resin of a wiring conductor, the electric resistance of the wiring conductor becomes large. SOLUTION: A precursor sheet 11 is prepared by adding and mixing an inorganic insulating powder and an epoxy resin base material which is cured by reacting with a curing agent by heating to a precursor of a bismaleimide triazine resin. a.11b.11c are prepared, and then the precursor sheet 11a. A metal paste 12 composed of a mixture of a metal powder and a curing agent that reacts with the epoxy resin base material is printed in a predetermined pattern on 11b and 11c, and then the precursor sheets 11a, 11b and 11c on which the metal paste 12 is printed are heated. Then, the metal powder of the metal paste 12 and the epoxy resin base material of the precursor sheets 11a, 11b and 11c and the metal paste are bonded to an insulating substrate formed by bonding an inorganic insulating powder with a thermosetting bismaleimide triazine resin. A wiring conductor made of epoxy resin cured by reacting with 12 curing agents is applied. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7521494-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-03048251-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013115184-A |
| priorityDate | 1997-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 33.