http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11101701-A

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7f42544f6b8a2c962c3b35d4bb3542bd
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-84
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01L9-06
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61B5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01L1-18
filingDate 1997-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_30928c8ec992f134f15d2812961a577f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b5e9674e5a5bc0feb2429a5982806957
publicationDate 1999-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H11101701-A
titleOfInvention Pressure sensor chip, manufacturing method thereof, and catheter having sensor mechanism
abstract (57) [Problem] To provide a pressure sensor chip suitable for a catheter or the like having a sensor mechanism that does not need to form a back pressure hole on a pedestal. The pressure sensor chip has a diaphragm formed on a silicon substrate by an etching technique. The surface of the diaphragm 13 is a pressure-sensitive surface 1 3a, and its back surface functions as a back pressure acting surface 13b. Groove 2 communicating between etching recess 14 on the side of back pressure acting surface 13b and side surface 12a of the silicon substrate Form one. When the pressure sensor chip 11 is used for a catheter, the groove 21 becomes a back pressure hole.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4697004-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017040650-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007263781-A
priorityDate 1997-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 23.