http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11101701-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7f42544f6b8a2c962c3b35d4bb3542bd |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-84 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01L9-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01L9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61B5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01L1-18 |
filingDate | 1997-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_30928c8ec992f134f15d2812961a577f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b5e9674e5a5bc0feb2429a5982806957 |
publicationDate | 1999-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-H11101701-A |
titleOfInvention | Pressure sensor chip, manufacturing method thereof, and catheter having sensor mechanism |
abstract | (57) [Problem] To provide a pressure sensor chip suitable for a catheter or the like having a sensor mechanism that does not need to form a back pressure hole on a pedestal. The pressure sensor chip has a diaphragm formed on a silicon substrate by an etching technique. The surface of the diaphragm 13 is a pressure-sensitive surface 1 3a, and its back surface functions as a back pressure acting surface 13b. Groove 2 communicating between etching recess 14 on the side of back pressure acting surface 13b and side surface 12a of the silicon substrate Form one. When the pressure sensor chip 11 is used for a catheter, the groove 21 becomes a back pressure hole. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4697004-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017040650-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007263781-A |
priorityDate | 1997-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 23.