Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_132d1d8c55ea986beac122fcd6141457 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-284 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K83-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K75-00 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-10 |
filingDate |
1996-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5c8f19269fd6f6c7decd98022acc9213 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_91eedb706c06d2679929ea08043d7697 |
publicationDate |
1998-04-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-H1098273-A |
titleOfInvention |
Printed circuit board insulation structure, manufacturing method and filling tool |
abstract |
(57) [Problem] To provide an insulating structure for preventing discharge between pins, a manufacturing method thereof, and a filling tool. SOLUTION: A projecting piece 29 of an enclosure 23 of a filling tool 21. Is inserted into the hole 7, the claw 31 of the protruding piece 29 is engaged with the groove 35, and the printed circuit board 1 is sandwiched between the surrounding portion 23 and the receiving portion 25. Next, the silicon 41 from above the enclosure 23 of FIG. Pour in. In this way, the silicon 41 is a, 9b and into the receiving part 25, Is solidified without leaving any gap. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6731958-B1 |
priorityDate |
1996-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |