| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f705f295f4ba571f5311e5ef1b57807 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| filingDate |
1997-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9c7787612963f788b7e8d5d6cccff8b1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fe5f6a06e8b0df82370844e6a7fec0fe |
| publicationDate |
1998-04-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H1098271-A |
| titleOfInvention |
Interlayer insulation and multilayer printed wiring board |
| abstract |
[PROBLEMS] To provide a configuration of a resin insulating layer suitable for providing a highly reliable printed wiring board capable of efficiently forming via holes without causing conduction failure due to undeveloped portions. To propose an interlayer insulating agent. A multilayer printed wiring board in which upper and lower conductive circuits are electrically insulated by a resin insulating layer and electrically connected via via holes provided in the resin insulating layer. The insulating layer, the upper layer is constituted by an adhesive layer 2b obtained by curing the adhesive for electroless plating, The lower layer is cured heat-resistant resin particles 18 having an average particle diameter of 0.1 to 2.0 μm, which are soluble in the acid or oxidant, in a heat-resistant resin which becomes hardly soluble in an acid or an oxidant by the curing treatment. Is a multi-layer printed wiring board comprising an insulating agent layer 2a obtained by curing an inter-layer insulating agent containing a dispersed layer of |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100466488-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011071557-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000022335-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6232398-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007157950-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-0001209-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000022334-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008118162-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1903842-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8533943-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6512186-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012047720-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009147387-A |
| priorityDate |
1996-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |