abstract |
[PROBLEMS] A print having high resolution, easy to develop with an alkaline aqueous solution, excellent in solvent resistance and plating solution resistance, and also having heat resistance to withstand the temperature of the soldering process. Provided are a resin composition and a cured product thereof particularly suitable for the production of a wiring board. An alkali-soluble polymer having a phenolic hydroxyl group (A), an epoxy resin (B), and a wavelength of 360 nm A resin composition comprising a cationic photopolymerization initiator (C) and a diluent (D), each of which is a sulfonium salt having a maximum molar extinction coefficient of 100 or more. |