http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H1092991-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-473
filingDate 1996-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2d4e4e339f569ef2ee81de4b04eb66e3
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publicationDate 1998-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H1092991-A
titleOfInvention Semiconductor device and method of manufacturing the same
abstract (57) [Summary] [PROBLEMS] To provide a structure of a new semiconductor element which handles a large amount of electric power and has a larger electric power and a smaller space. SOLUTION: A semiconductor element characterized in that a basic component of a semiconductor element such as a semiconductor or an insulating film is directly formed by using a pipe-shaped member or the like as a base, and a coolant is caused to flow through a pipe portion. Further, as a method of manufacturing the semiconductor element, a semiconductor element can be easily manufactured by placing the substrate in a material gas atmosphere and generating a layer containing the material by heating or gas discharge.
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priorityDate 1996-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 23.