| abstract |
(57) [Problem] A copper alloy excellent in hot workability without edge cracking at the time of hot working, capable of manufacturing electrical and electronic components such as lead frames for semiconductor devices such as ICs and LSIs and terminal connectors. I will provide a. SOLUTION: Fe: 1.8 to 2.4% by weight, P: 0. 001 to 0.1% by weight, Zn: 0.001 to 1.0% by weight, Pd: 0.0001 to 1.5, Mn: 0.003 to A copper alloy containing 0.15% by weight, the balance being Cu and inevitable impurities, and having excellent hot workability. |