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filingDate 1997-06-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7287922f3c2ca875484c0a0b160e7c03
publicationDate 1998-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H1079105-A
titleOfInvention Conductor forming method for magnetic head transducer, solder bonding, head suspension assembly, and magnetic recording disk file
abstract (57) Abstract: A method of forming an electrical solder joint between a thin-film magnetic head transducer and a conductor in an integrated suspension after mechanically attaching the thin-film magnetic head transducer to a suspension, and a method thereof. A solder connection, a head suspension assembly with the thin film magnetic head transducer, and a magnetic recording disk file with the head suspension assembly. SOLUTION: The thin film magnetic head (16, not shown). Termination pads (18) and conductor lead pads (28) Between the solder balls (3) by using a capillary tube (32). 0) and the laser beam focused on the solder ball A beam (34) is emitted to cause reflow, so that the solder joints have a pair of very thin layers of intermediate compound (5) in the area where they abut the thin film magnetic head and termination pad. 6, not shown).
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009233686-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100376343-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006305634-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-03032297-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7400470-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1651021-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7924529-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010004017-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007118072-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013041647-A
priorityDate 1996-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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