Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3494 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01327 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0465 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10083 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09427 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-742 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P70-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2101-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-041 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3442 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-0056 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11B5-10 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G11B5-127 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-005 |
filingDate |
1997-06-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7287922f3c2ca875484c0a0b160e7c03 |
publicationDate |
1998-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-H1079105-A |
titleOfInvention |
Conductor forming method for magnetic head transducer, solder bonding, head suspension assembly, and magnetic recording disk file |
abstract |
(57) Abstract: A method of forming an electrical solder joint between a thin-film magnetic head transducer and a conductor in an integrated suspension after mechanically attaching the thin-film magnetic head transducer to a suspension, and a method thereof. A solder connection, a head suspension assembly with the thin film magnetic head transducer, and a magnetic recording disk file with the head suspension assembly. SOLUTION: The thin film magnetic head (16, not shown). Termination pads (18) and conductor lead pads (28) Between the solder balls (3) by using a capillary tube (32). 0) and the laser beam focused on the solder ball A beam (34) is emitted to cause reflow, so that the solder joints have a pair of very thin layers of intermediate compound (5) in the area where they abut the thin film magnetic head and termination pad. 6, not shown). |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009233686-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100376343-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006305634-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-03032297-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7400470-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1651021-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7924529-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010004017-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007118072-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013041647-A |
priorityDate |
1996-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |