http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H107769-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07D487-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
filingDate | 1996-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_de232b82988fd389d8bd23046e9ff4a5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b2734ad61dedaae0120a04c766000f23 |
publicationDate | 1998-01-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-H107769-A |
titleOfInvention | Imide ring-containing phenolic resin, method for producing the same, and epoxy resin composition using the phenolic resin as a curing agent |
abstract | (57) [Summary] [Problem] A phenol resin having a thermally stable skeleton, More specifically, a phenolic resin capable of imparting excellent solder heat resistance when used as a curing agent in an epoxy resin composition for semiconductor encapsulation, a method for producing the same, and an epoxy resin composition for semiconductor encapsulation having excellent solder heat resistance Offer things. SOLUTION: By adding a catalytic amount of an organic phosphorus compound to a monomaleimide compound having at least one phenolic hydroxyl group in a molecule to trimerize, a spiro ring having an effect of reducing shrinkage at the time of molding is formed. An imide ring-containing phenol resin having an electrically stable 5-membered ring structure is synthesized, and this imide ring-containing phenol resin is used as a curing agent for an epoxy resin composition for semiconductor encapsulation. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016023195-A |
priorityDate | 1996-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 48.