http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H107769-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07D487-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
filingDate 1996-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_de232b82988fd389d8bd23046e9ff4a5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b2734ad61dedaae0120a04c766000f23
publicationDate 1998-01-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H107769-A
titleOfInvention Imide ring-containing phenolic resin, method for producing the same, and epoxy resin composition using the phenolic resin as a curing agent
abstract (57) [Summary] [Problem] A phenol resin having a thermally stable skeleton, More specifically, a phenolic resin capable of imparting excellent solder heat resistance when used as a curing agent in an epoxy resin composition for semiconductor encapsulation, a method for producing the same, and an epoxy resin composition for semiconductor encapsulation having excellent solder heat resistance Offer things. SOLUTION: By adding a catalytic amount of an organic phosphorus compound to a monomaleimide compound having at least one phenolic hydroxyl group in a molecule to trimerize, a spiro ring having an effect of reducing shrinkage at the time of molding is formed. An imide ring-containing phenol resin having an electrically stable 5-membered ring structure is synthesized, and this imide ring-containing phenol resin is used as a curing agent for an epoxy resin composition for semiconductor encapsulation.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016023195-A
priorityDate 1996-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6905
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID9831062
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID425356381
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID996
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414023585
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID7681
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID20473
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID456438065
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID22508360
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419596734
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID412798128
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415907889
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID54707127
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414871446
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID335
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415777387
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419474448
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414017907
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID423120614
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID406970473
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419487839
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419518007
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID10614
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23437541
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID83648
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID423031856
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID226393271
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID12749
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID458397310
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID11776
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419526217
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23437540
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID15624
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID13662
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID452244850

Total number of triples: 48.