http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H1072694-A

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filingDate 1996-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d597078b6e3d58def233067aa62cc2e2
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publicationDate 1998-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H1072694-A
titleOfInvention Surface coating material by tin and tin-lead alloy plating, and electronic parts using the coating material
abstract (57) [Summary] [PROBLEMS] To reduce the amount of shavings generated from a plating film when machining a surface coating material of a tin or tin-lead alloy plating film (for example, a lead of an electronic component). SOLUTION: In a surface coating material for coating a tin-lead alloy plating film on a base metal by electroplating, β in the plating film with respect to the direction of external force applied to the surface coating material. -The β-tin crystal is preferentially oriented such that the <001> direction of the Miller index in the tin crystal lattice forms a high angle of 90 to 35 degrees. Since the <001> direction, which is also the slip direction of the β-tin crystal, is at a high angle with respect to the external force direction in which the processing is performed, the plating film is less likely to be plastically deformed in this external force direction, and the shavings of the plating film are reduced. The amount of generation can be kept low.
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priorityDate 1996-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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